Do you know epoxy resin for high-performance electronic packaging materials?

Electronic packaging adhesive is a kind of electronic glue or adhesive used to seal, package or encapsulate electronic devices. After being sealed by electronic packaging adhesive, it can play the role of waterproof, moisture-proof, shockproof, dustproof, anti-corrosion, heat dissipation, confidentiality, etc. Therefore, the electronic packaging adhesive needs to have the characteristics of high and low temperature resistance, high dielectric strength, good insulation, environmental protection and safety.

Why choose epoxy resin as electronic packaging adhesive?

Epoxy resin has excellent heat resistance, electrical insulation, adhesion, dielectric property, mechanical property, small shrinkage, chemical resistance, and good processability and operability after adding curing agent. Therefore, at present, foreign semiconductor devices are mostly encapsulated with epoxy resin.

The development of epoxy resin

With the increasing call for environmental protection and the increasing requirements of the integrated circuit industry for the performance of electronic packaging materials, higher requirements are put forward for epoxy resin. In addition to the high purity of epoxy resin used for IC packaging, low stress, thermal shock resistance and low water absorption are also problems to be solved.

In the future production, in order to make the epoxy resin fully applied in the domestic electronic packaging industry, the development orientation of this research is to improve the production process technology, explore the curing system of high performance epoxy resin and medium-temperature high performance epoxy resin, as well as the preparation of new epoxy resin modification additives.

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